Effect of curing pressure on the strength of adhesively bonded joints


AYDIN M. D. , TEMIZ S., Oezel A.

JOURNAL OF ADHESION, cilt.83, ss.553-571, 2007 (SCI İndekslerine Giren Dergi) identifier identifier

  • Cilt numarası: 83 Konu: 6
  • Basım Tarihi: 2007
  • Doi Numarası: 10.1080/00218460701453536
  • Dergi Adı: JOURNAL OF ADHESION
  • Sayfa Sayıları: ss.553-571

Özet

It is important to be able to predict the mechanical response of adhesively bonded joints. To succeed in this, the accurate simulation of the behavior of adhesively bonded joints is an essential requirement because of the strain rate, temperature, and hydrostatic sensitivity of adhesive properties, which should be taken into consideration when developing a material model [ 1 - 11]. On the other hand, the load capabilities of adhesively bonded joints are affected by both applied pressure and temperature during cure. For this reason, in this study, the tensile load capabilities of single lap joints (SLJs) bonded with a flexible adhesive that possesses pressure- sensitive properties were experimentally investigated with respect to the applied pressure during the curing operation, and the experimental results were compared with finite element analysis (FEA) results. Finally, in addition to other parameters, such as the dependence on strain rate and the lack of yield criteria of adhesives, it was seen that the residual thermal stresses that occurred as a result of the applied pressure during the curing process at elevated temperature need to be taken into consideration to accurately simulate the mechanical behavior of adhesively bonded joints.